Japan Intellectual Property Rights: SHEET FOR FORMING FIRST PROTECTIVE FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND USE OF SHEET

Japan, March 3 -- LINTEC CORP has got intellectual property rights for 'SHEET FOR FORMING FIRST PROTECTIVE FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND USE OF SHEET.' Other related details are as follows:

Application Number: JP,2022-003125

Category (FI): H01L21/304,622@J,H01L21/56@R,H01L21/68@N,H01L21/78@M,H01L21/92,604@S,H01L23/30@D,H10P52/00@M,H10P58/00@M,H10P72/70,H10W72/20,103@G,H10W74/01@R,H10W74/15

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 12, 2022

Publication Date: July 25, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.