Japan, Sept. 30 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'SiC SUBSTRATE AND SiC EPITAXIAL WAFER.' Other related details are as follows:
Application Number: JP,2023-136613
Category (FI): C30B29/36@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 24, 2023
Publication Date: March 7, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
