Japan, Jan. 20 -- TOYOTA MOTOR CORP,DENSO CORP,MIRISE TECHNOLOGIES CORP has got intellectual property rights for 'SILICON CARBIDE WAFER MANUFACTURING DEVICE.' Other related details are as follows:
Application Number: JP,2022-210956
Category (FI): H10P14/24,H01L21/205,C23C16/455,C23C16/42
Stage: Grant (IP right document published.)
Filing Date: Dec. 27, 2022
Publication Date: July 9, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
