Japan, Sept. 7 -- TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'SILICON ETCHANT AND SILICON ETCHING METHOD.' Other related details are as follows:
Application Number: JP,2023-043628
Category (FI): H01L21/308@B,H10P50/64@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 17, 2023
Publication Date: Oct. 17, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
