Japan, June 10 -- SUMCO CORP has got intellectual property rights for 'SLICING CONDITION DETERMINATION METHOD OF SEMICONDUCTOR INGOT AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER.' Other related details are as follows:
Application Number: JP,2023-014321
Category (FI): H10P54/40,101@W,H01L21/304,611@W
Stage: Grant (IP right document published.)
Filing Date: Feb. 2, 2023
Publication Date: Aug. 15, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
