Japan, July 1 -- SHIN ETSU HANDOTAI CO LTD has got intellectual property rights for 'SOI WAFER AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2023-135700
Category (FI): C30B29/06@A,H10P14/20,C30B25/20,C30B33/02,H01L21/205,H01L21/20,H01L27/12@B,H10W10/00,101@B,H10P14/24
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 23, 2023
Publication Date: March 7, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
