Japan, Sept. 9 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE WITH SOLDER BUMP.' Other related details are as follows:
Application Number: JP,2025-060971
Category (FI): H10W72/20,101@A,H01L21/92,604@F,H10W72/20,103@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 2, 2025
Publication Date: June 19, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
