Japan, Aug. 26 -- TAMURA SEISAKUSHO CO LTD has got intellectual property rights for 'SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE.' Other related details are as follows:
Application Number: JP,2024-037097
Category (FI): H05K3/346,B23K35/26,310@A,C22C13/00,B23K35/363@C,H05K3/34,512@C,B23K35/363@D
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 11, 2024
Publication Date: Sept. 25, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
