Japan, Jan. 16 -- TEXAS INSTRUMENTS INC has got intellectual property rights for 'STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING.' Other related details are as follows:
Application Number: JP,2023-187382
Category (FI): H01L23/12,501@P,H10W70/62,500
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 1, 2023
Publication Date: Jan. 9, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
