Japan Intellectual Property Rights: SUBSTRATE FOR IMPRINT MOLD, BLANK FOR IMPRINT MOLD, IMPRINT MOLD, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING OPTICAL COMPONENT

Japan, Jan. 16 -- HOYA CORP has got intellectual property rights for 'SUBSTRATE FOR IMPRINT MOLD, BLANK FOR IMPRINT MOLD, IMPRINT MOLD, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING OPTICAL COMPONENT.' Other related details are as follows:

Application Number: JP,2022-036622

Category (FI): B29C59/02@B,H01L21/30,502@D,H10P76/00,600

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 9, 2022

Publication Date: Sept. 22, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.