Japan, July 14 -- SCREEN HOLDINGS CO LTD has got intellectual property rights for 'SUBSTRATE PROCESSING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-134813
Category (FI): H01L21/304,648@G,H01L21/304,643@A,H01L21/304,651@L,H01L21/304,651@M,H10P70/00,103@A,H10P70/00,108@G,H10P70/00,201@M,H10P70/00,201@L
Stage: PROBLEM TO BE SOLVED: To observe a peripheral edge portion of a substrate such as a semiconductor wafer while restraining a thermal effect by a heating mechanism for obtaining heating gas in a substrate processing apparatus that performs heating of the substrate with the heating gas and processing on the peripheral edge portion of the substrate while holding the substrate in an internal space of a chamber by a substrate holder.SOLUTION: In a substrate processing apparatus, a heating mechanism for heating a substrate includes a gas discharge nozzle placed in an internal space, a heater attached to the outer wall of a chamber, and a pipeline for sending an inert gas heated by the heater to a gas discharge nozzle. A light source unit and an imaging unit included in an observation mechanism for observing a peripheral edge portion of the substrate are arranged in the internal space of the chamber and at a distant position which is apart from a heater-attached site on the outer wall of the chamber. Therefore, the light source unit and the imaging unit are hardly affected by the heat generated by the heater, so that deterioration in observation accuracy due to the influence of temperature change is prevented.SELECTED DRAWING: Figure 4 (Grant)
Filing Date: Aug. 26, 2022
Publication Date: March 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
