Japan, Sept. 18 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE PROCESSING APPARATUS.' Other related details are as follows:
Application Number: JP,2025-090190
Category (FI): H10P95/90,101@P,H01L21/324@P,H01L21/324@G,H10P95/90,101@G,H10P50/20,101@C,H10P95/90,101@R,H10P95/90,101@J,H05B6/10,381,H01L21/324@R,H01L21/302,101@C,H01L21/324@J,H05H1/46@L
Stage: PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of wirelessly adjusting the temperature of an inner wall surface of a processing space in which substrate processing is performed.SOLUTION: A substrate processing apparatus for processing a substrate includes a processing chamber in which a processing space for the substrate is formed, a heating mechanism for adjusting the internal temperature of the processing chamber, and a shield member provided inside the processing chamber, positioned at a distance from the inner wall surface of the processing chamber, and defining at least a portion of the side wall of the processing space, and the heating mechanism includes an induction heating element that generates heat by an induction magnetic field to heat at least the shield member, and a magnetic field generating unit that is positioned along the outer wall surface of the processing chamber and generates the induction magnetic field.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: May 29, 2025
Publication Date: Aug. 20, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
