Japan Intellectual Property Rights: SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Japan, April 22 -- KIOXIA CORP has got intellectual property rights for 'SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-150124

Category (FI): H01L21/304,643@A,H01L21/304,643@C,H10P70/00,103@A,H10P70/00,103@C,H10P50/66,H10P50/68@A,H01L21/306@D,H01L21/306@F

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 21, 2022

Publication Date: April 2, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.