Japan, July 14 -- SCREEN HOLDINGS CO LTD has got intellectual property rights for 'SUBSTRATE PROCESSING DEVICE.' Other related details are as follows:
Application Number: JP,2022-105697
Category (FI): H10P70/00,103@A,H01L21/304,643@A,H10P72/70,H01L21/68@N
Stage: PROBLEM TO BE SOLVED: To ensure that a process liquid bouncing back from substrate periphery does not adhere to the substrate during processing by the process liquid.SOLUTION: A substrate processing device 2 comprises: a support part 32 to which a substrate 9 is attached, with the substrate 9 being in a first support state of being supported horizontally, and that supports an attachment member 81 that expands to the surrounding of the substrate 9; a lifting part 33 that is located in proximity to the periphery of the substrate 9 in the first support state, and that, with a region of the attachment member 81 taken as a substrate periphery part, lifts the substrate 9 relatively to the substrate periphery part while deforming the attachment member 81 in the surrounding of the substrate 9, thereby forming a second support state where the relative position of the substrate 9 to the substrate periphery part is higher than in the first support state; and a process liquid supply part 42 that supplies a process liquid to the top surface of the substrate 9 in the second support state so as to process the top surface. Thus, it is possible to ensure that a process liquid bouncing back from the substrate periphery part does not adhere to the substrate 9 during processing by the process liquid.SELECTED DRAWING: Figure 4 (Grant)
Filing Date: June 30, 2022
Publication Date: Jan. 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
