Japan, June 10 -- TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'SUBSTRATE STICKING DEVICE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE STICKING METHOD.' Other related details are as follows:
Application Number: JP,2022-116368
Category (FI): H01L21/02@C,H10P10/00@Z,H10P56/00@X,H01L21/02@B,H10P10/00@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 21, 2022
Publication Date: Feb. 1, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
