Japan, March 5 -- DENSO CORP,TOYOTA CENTRAL R&D LABS INC has got intellectual property rights for 'THERMAL CONDUCTIVE MATERIAL AND PRODUCING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2023-009113
Category (FI): C09K5/14@E,H01L23/36@M,H10W40/25,C08K3/38,C08K3/28,C08L101/00,C08K7/00
Stage: PROBLEM TO BE SOLVED: To provide a thermal conductor capable of realizing high thermal conductivity.SOLUTION: The present invention is a thermal conductive material formed by dispersing a filler containing spherical particles made of aluminum nitride and plate-like particles made of boron nitride dispersed in a matrix made of a resin. A volume ratio of plate-like particles to spherical particles is, for example, 0.4-1.5. A particle size ratio of the plate-shaped particles to the spherical particles is, for example, 0.05-0.5. The volume ratio of the filler to the total thermal conductive material is, for example, 73-93 vol.%. A thermal conductive material that satisfies such conditions can exhibit remarkably high thermal conductivity. The thermal conductive material is obtained, for example, through a preparation step of obtaining a mixture in which the spherical particles, the plate-like particles, and the resin are mixed, and a molding step in which the mixture is converted into a molded body. The preparation process may be divided into multiple stages.SELECTED DRAWING: Figure 2A (Grant)
Filing Date: Jan. 25, 2023
Publication Date: Aug. 6, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
