Japan, Feb. 24 -- IIDA SANGYO KK has got intellectual property rights for 'THERMALLY EXPANDABLE REFRACTORY MOLDING.' Other related details are as follows:
Application Number: JP,2022-025831
Category (FI): E04B1/94@H,E04B1/94@N,A62C2/00@X
Stage: PROBLEM TO BE SOLVED: To improve workability when a thermally expandable refractory molding to be inserted into a gap of a building member is inserted into the gap.SOLUTION: An aspect of the present disclosure is a thermally expandable refractory molding inserted into a gap in a building member. A thermally expandable refractory molding product is provided with a cylindrical part and a resistance part. The cylindrical part is formed in a cylindrical shape with a hollow inside. The resistance part is composed of a first resistance part formed so as not to block a cross-section in an intersecting direction intersecting a height direction of the cylindrical part, and a second resistance part formed so as to block a cross section in the intersecting direction intersecting the height direction of the cylindrical part, and is configured to resist deformation when the cylindrical part is deformed by an external force.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Feb. 22, 2022
Publication Date: Sept. 1, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
