Japan, Sept. 30 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'THERMOSETTING ADHESIVE COMPOSITION, LAYERED FILM, CONNECTED STRUCTURE, AND PRODUCTION METHOD THEREFOR.' Other related details are as follows:
Application Number: JP,2022-067897
Category (FI): C09J11/08,C09J11/04,C09J7/35,C09J201/00,H10W72/30@E,C09J11/06,C09J5/06,H01L21/52@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 15, 2022
Publication Date: Oct. 26, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
