Japan, July 1 -- SHIN ETSU CHEM CO LTD has got intellectual property rights for 'THERMOSETTING RESIN COMPOSITION, ADHESIVE USING THE SAME, SEMICONDUCTOR ENCAPSULATING AGENT AND FILM MADE BY CURING THE SAME, PREPREG, AND SUBSTRATE.' Other related details are as follows:
Application Number: JP,2023-101356
Category (FI): H01L23/30@R,C08L25/18,C08L79/00@B,C09J179/04@B,H05K1/03,610@H,C08F222/40,C08F212/34,C08J5/24,C09J4/00,H10W74/47
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 21, 2023
Publication Date: Jan. 9, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
