Japan, March 5 -- DIC CORP has got intellectual property rights for 'THERMOSETTING RESIN COMPOSITION, BULK MOLDING COMPOUND AND MOLDED ARTICLE THEREOF.' Other related details are as follows:
Application Number: JP,2022-105814
Category (FI): C08F2/44@A,C08F2/44@C,C08F212/08,C08F283/01
Stage: PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition that offers excellent mixability and storage stability, exhibits low shrinkage during molding, and yields a molded article with superior flame retardancy and thermal conductivity as well as a low specific gravity; a bulk molding compound; and a molded article thereof.SOLUTION: A thermosetting resin composition contains an unsaturated polyester resin (A), a shrinkage reducer (B), aluminum hydroxide (C), magnesium oxide (D), and a hollow filler (E).SELECTED DRAWING: None (Grant)
Filing Date: June 30, 2022
Publication Date: Jan. 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
