Japan, July 14 -- SK HYNIX INC,TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'THINNER COMPOSITION AND SURFACE TREATMENT METHOD OF SEMICONDUCTOR SUBSTRATE USING THE SAME.' Other related details are as follows:
Application Number: JP,2022-010139
Category (FI): B05D3/10@H,B05D3/10@N,B05D7/00@C,B05D7/24,301@T,G03F7/42,H01L21/30,564@D,H01L21/304,647@A,H10P70/00,107@A,H10P76/00,564@D
Stage: PROBLEM TO BE SOLVED: To provide a thinner composition for removing a resist and a surface treatment method of a semiconductor substrate using the thinner composition.SOLUTION: The thinner composition contains (a) a propylene glycol monoalkyl ether, (b) a propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone. The surface treatment method of a semiconductor substrate includes the steps of: applying a resist composition to a semiconductor substrate; and removing the applied resist composition by using the thinner composition of the present invention.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Jan. 26, 2022
Publication Date: Aug. 10, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
