Japan, March 24 -- SEIKO EPSON CORP has got intellectual property rights for 'THREE-DIMENSIONAL MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2022-071716
Category (FI): B29C64/106,B29C64/209,B29C64/30,B33Y30/00
Stage: Grant (IP right document published.)
Filing Date: April 25, 2022
Publication Date: Nov. 7, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
