Japan, Oct. 7 -- SEIKO EPSON CORP has got intellectual property rights for 'THREE-DIMENSIONAL MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2022-116982
Category (FI): B29C64/295,B29C64/106,B33Y40/00,B29C64/321,B29C64/209,B33Y30/00
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 22, 2022
Publication Date: Feb. 1, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
