Japan, June 10 -- SEIKO EPSON CORP has got intellectual property rights for 'THREE-DIMENSIONAL MOLDING METHOD.' Other related details are as follows:
Application Number: JP,2022-112322
Category (FI): B29C64/393,B33Y10/00,B29C64/336,B33Y50/02,B29C64/118
Stage: Grant (IP right document published.)
Filing Date: July 13, 2022
Publication Date: Jan. 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
