Japan Intellectual Property Rights: UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

Japan, Jan. 16 -- LAM RESEARCH CORPORATION has got intellectual property rights for 'UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION.' Other related details are as follows:

Application Number: JP,2023-126668

Category (FI): G03F7/004,G03F7/004,531,G03F7/11,503,G03F7/16,G03F7/20,501,G03F7/20,503,G03F7/20,521,G03F7/26,G03F7/40,521,H01L21/30,563,H01L21/30,573,H01L21/312@A,H10P14/68@A,H10P76/00,563

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 3, 2023

Publication Date: Oct. 2, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.