Japan Intellectual Property Rights: WAFER DRYING DEVICE AND WAFER DRYING METHOD

Japan, Aug. 26 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'WAFER DRYING DEVICE AND WAFER DRYING METHOD.' Other related details are as follows:

Application Number: JP,2022-099550

Category (FI): H10P70/00,108@G,H01L21/304,648@K,H01L21/304,648@L,H01L21/304,651@Z,H01L21/304,648@G,H10P70/00,201@Z,H10P70/00,201@N,H10P70/00,108@L,H10P70/00,108@K

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 21, 2022

Publication Date: Jan. 19, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.