Japan, April 22 -- EV GROUP E THALLNER GMBH has got intellectual property rights for 'WAFER PERMANENT BONDING METHOD.' Other related details are as follows:
Application Number: JP,2024-201503
Category (FI): H01L21/02@B,H10P10/00@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 19, 2024
Publication Date: Feb. 6, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
