Japan, Jan. 15 -- YAMAHA MOTOR CO LTD has got intellectual property rights for 'WAFER PROCESSING DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP.' Other related details are as follows:
Application Number: JP,2022-073735
Category (FI): H01L21/78@B,H10P58/00@B
Stage: Grant (IP right document published.)
Filing Date: April 27, 2022
Publication Date: Nov. 9, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
