Japan, March 5 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD AND WAFER.' Other related details are as follows:
Application Number: JP,2021-206615
Category (FI): H10P52/00@Y,B24B7/04@Z,H01L21/304,601@B,H10P95/60@B
Stage: PROBLEM TO BE SOLVED: To provide a wafer processing method which can prevent a device from being damaged due to an etching liquid to be used when applying wet etching to a rear surface side of a device wafer included in a bonded wafer.SOLUTION: Provided is a wafer in which an inclined plane is formed in an outer peripheral region. Further, when liquid (for example, an etching liquid to be used for wet etching) is supplied to the outer peripheral region, the liquid flows on the inclined plane to easily flow to the outside of the wafer. Therefore, in a bonded wafer in which the wafer has been applied as a support wafer, a device is prevented from being damaged due to an etching liquid to be used when applying wet etching to a rear surface side of a device wafer.SELECTED DRAWING: Figure 3 (Grant)
Filing Date: Dec. 21, 2021
Publication Date: July 3, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
