Japan Intellectual Property Rights: WAFER PROCESSING METHOD

Japan, Oct. 7 -- DISCO CORP has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:

Application Number: JP,2022-170539

Category (FI): H10P10/00@A,H10P72/70,H10P52/00@Y,H10P95/60@Z,H10P54/30,H10P54/20,201,H10P52/00@R,H10P52/00@C,H01L21/02@B,H01L21/304,631,H01L21/304,601@Z,H10P10/00@X,H10P10/00@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Oct. 25, 2022

Publication Date: May 10, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.