Japan, Feb. 24 -- SHENG CHUAN TECHNOLOGY CO LTD has got intellectual property rights for 'WAFER RING POSITIONING STAGE.' Other related details are as follows:
Application Number: JP,2025-018818
Category (FI): H10P72/70,H01L21/68@N
Stage: PROBLEM TO BE SOLVED: To provide a wafer ring positioning stage for preventing deformation of a wafer ring caused by an excessive clamping force for holding and fixing the wafer ring.SOLUTION: In a wafer ring positioning stage having a main body part 20 on which a wafer ring A is to be placed, the main body part includes: a first plane 21 set horizontally on the main body part; a first fixed abutment member 231 and a first movable abutment member 241, which are located at two opposing ends of the main body part and set in the first plane; a driving member for driving the first movable abutment member so that the first movable abutment member will become closer to or more distant from the first fixed abutment member in order to clamp the wafer ring; and an elastic member for urging the first movable abutment member to move away from the first fixed abutment member.SELECTED DRAWING: Figure 3 (Grant)
Filing Date: Feb. 7, 2025
Publication Date: Aug. 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
