Japan, Aug. 26 -- HIRAKAWA HEWTECH CORP has got intellectual property rights for 'WIRE CONNECTION STRUCTURE, MANUFACTURING METHOD FOR THE SAME, AND WIRE ASSEMBLY.' Other related details are as follows:
Application Number: JP,2024-081292
Category (FI): H01R43/28,H01R9/11
Stage: Grant (IP right granted following substantive examination.)
Filing Date: May 17, 2024
Publication Date: Nov. 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
