Japan, March 5 -- NIPPON STEEL CORP has got intellectual property rights for 'WIRE MATERIAL.' Other related details are as follows:
Application Number: JP,2022-113971
Category (FI): C22C38/00,301@Y,C22C38/54,C22C38/16,C21D8/06@A
Stage: PROBLEM TO BE SOLVED: To provide a wire material capable of suppressing the generation of blisters.SOLUTION: There is provided a wire material having a chemical composition comprising by mass%, 0.70 to 1.20% of C, 0.10 to 1.00% of Si, 0.10 to 1.00% of Mn, 0.020% or less of P, 0.020% or less of S, more than 0.005% to 0.080% of Al, 0.0010 to 0.0100% of N, 0.010 to 0.500% of Cu, 0.010 to 0.500% of Ni, 0.003 to 0.100% of Sn and 0.0030% or less of O and the balance Fe with impurities, wherein when the index of a Cu content in the surface layer of the wire is defined as [Cu]S, the index of a Sn content is defined as [Sn]S, the index of a Cu content inside the wire is defined as [Cu]B and the index of a Sn content is defined as [Sn]B, the following expression (1) is satisfied. ([Cu]S+[Sn]S)/([Cu]B+[Sn]B)>1.10 (1).SELECTED DRAWING: None (Grant)
Filing Date: July 15, 2022
Publication Date: Jan. 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
