Japan, Oct. 7 -- KYOCERA CORP has got intellectual property rights for 'WIRING BOARD, WIRING STRUCTURE BODY INCLUDING WIRING BOARD, PACKAGE FOR ELECTRONIC COMPONENT IMPLEMENTATION, AND ELECTRONIC MODULE.' Other related details are as follows:
Application Number: JP,2022-155074
Category (FI): H10W70/00@K,H01L23/02@H,H05K1/02@C,H05K1/14@A,H10W76/10@H,H01L23/12@K
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 28, 2022
Publication Date: April 9, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.