Japan, Nov. 18 -- 日本電子計算株式会社 holds the trademark for 'Ｂｏｎｄ Ｓｑｕａｒｅ.' Other related details are as follows:
Application Number: Reg.No.6984588
Class: 09,42
Status: LIVE-REGISTRATION-Published for Opposition
Filing Date: March 31
Registration Date: Nov. 7
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/c1801/TR/JP-2025-034177/40/en
Disclaimer: Curated by HT Syndication.
