Japan, Aug. 6 -- HUAWEI TECHNOLOGIES CO LTD has got intellectual property rights for 'PICTURE PREDICTION METHOD AND DEVICE.' Other related details are as follows: Application Number: JP,2024-164149 Category (FI): H04N19/70,H04N19/176,H04N19/157,H04N19/105 Stage: Grant (IP right granted following substantive examination.) Filing Date: Sept. 20, 2024 Publication Date: Dec. 13, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Synd...
Japan, Aug. 6 -- TOYOTA INDUSTRIES CORP has got intellectual property rights for 'POWER CONVERSION DEVICE.' Other related details are as follows: Application Number: JP,2023-091764 Category (FI): H02M7/48@M Stage: Grant (IP right granted following substantive examination.) Filing Date: June 2, 2023 Publication Date: Dec. 12, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'CONTROL DEVICE FOR INTERNAL COMBUSTION ENGINE.' Other related details are as follows: Application Number: JP,2023-091686 Category (FI): F02D43/00,301@R,F02B37/20,F02D23/00@P Stage: Grant (IP right granted following substantive examination.) Filing Date: June 2, 2023 Publication Date: Dec. 12, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication...
Japan, Aug. 6 -- EBARA CORP,TOKAI NATIONAL HIGHER EDUCATION & RESEARCH SYSTEM has got intellectual property rights for 'METHOD FOR DEPOSITING PROTECTIVE FILM IN OUTER PERIPHERAL PART OF SUBSTRATE INCLUDING BEVEL PORTION.' Other related details are as follows: Application Number: JP,2023-090817 Category (FI): C23C16/27,C23C16/42,C23C16/50,H10P14/60,101@C,C23C16/26,H01L21/31@C Stage: Grant (IP right granted following substantive examination.) Filing Date: June 1, 2023 Publication Date: Dec. 1...
Japan, Aug. 6 -- JFE ENGINEERING CORP has got intellectual property rights for 'COLUMNAR STRUCTURE TOPPLING PREVENTION STRUCTURE AND EXCAVATION TRENCH OPENING METHOD.' Other related details are as follows: Application Number: JP,2023-089339 Category (FI): E02D27/42@Z,H02G7/00,E04H12/22 Stage: Grant (IP right granted following substantive examination.) Filing Date: May 31, 2023 Publication Date: Dec. 12, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 D...
Japan, Aug. 6 -- DENSO CORP has got intellectual property rights for 'WIRELESS COMMUNICATION SYSTEM AND WIRELESS COMMUNICATION METHOD.' Other related details are as follows: Application Number: JP,2023-088790 Category (FI): H04W72/542,H04W72/0453,H04W72/541,H04W84/10,110 Stage: Grant (IP right granted following substantive examination.) Filing Date: May 30, 2023 Publication Date: Dec. 12, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Cura...
Japan, Aug. 6 -- YOKOGAWA ELECTRIC CORP has got intellectual property rights for 'ELECTRONIC APPARATUS.' Other related details are as follows: Application Number: JP,2023-088093 Category (FI): H05K5/00@A,H05K5/03@B Stage: Grant (IP right granted following substantive examination.) Filing Date: May 29, 2023 Publication Date: Dec. 11, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Aug. 6 -- TDK CORP has got intellectual property rights for 'POSITION DETECTION DEVICE, LENS MODULE AND IMAGING DEVICE.' Other related details are as follows: Application Number: JP,2023-086690 Category (FI): H04N23/50,G03B5/00@J,G01B7/00,102@M,G01D5/245,110@L,G02B7/04@E Stage: Grant (IP right granted following substantive examination.) Filing Date: May 26, 2023 Publication Date: Dec. 6, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer...
Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING SOFT-MAGNETIC MATERIAL LAMINATE BODY.' Other related details are as follows: Application Number: JP,2023-085985 Category (FI): H02K1/02@B,H01F41/02@C,H02K15/0273,C22C45/02@A,C22C38/00,303@S,C21D9/00@S,C21D6/00@C,H01F41/02@B,B32B15/08@K,B32B15/08@E,H02K15/02@A Stage: Grant (IP right granted following substantive examination.) Filing Date: May 25, 2023 Publication Date: Dec. 5, 2024 The orig...
Japan, Aug. 6 -- DENSO CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2023-085780 Category (FI): H01L23/28@A,H10B80/00,H10W40/20@A,H10W70/40,300,H10W74/10@A,H10W90/00,800,H01L25/04@C,H10W70/40@H,H10W40/20@B,H01L23/48@G,H01L23/34@A,H10W74/10@B Stage: Grant (IP right granted following substantive examination.) Filing Date: May 24, 2023 Publication Date: Dec. 5, 2024 The original document can be viewed at: htt...