Japan, March 5 -- TOYOTA INDUSTRIES CORP,TOYOTA CENTRAL R&D LABS INC has got intellectual property rights for 'SORTING MACHINE SYSTEM, SORTING METHOD, AND COMPUTER PROGRAM.' Other related details are as follows: Application Number: JP,2022-117081 Category (FI): B65G1/137@A Stage: PROBLEM TO BE SOLVED: To optimize unloading order including a post-process performed after loading/unloading of a container into/from a sorting machine.SOLUTION: A sorting machine system comprises: a sorting machine ...
Japan, March 5 -- ITO DENKI KK has got intellectual property rights for 'CULTIVATION TRAY AND PLANT CULTIVATION METHOD.' Other related details are as follows: Application Number: JP,2022-116586 Category (FI): A01G31/04@A,A01G31/00,611@Z Stage: PROBLEM TO BE SOLVED: To provide a cultivation tray for hydroponic cultivation using a medium, and to provide a plant cultivation method.SOLUTION: A cultivation tray 1 is for hydroponic cultivation by holding plant seedlings and comprises a tray body 2,...
Japan, March 5 -- TOSHIBA TEC CORP has got intellectual property rights for 'IMAGE PROCESSING APPARATUS AND IMAGE FORMING APPARATUS.' Other related details are as follows: Application Number: JP,2022-116001 Category (FI): H04N1/00@C,G03G21/00,370,B41J29/40,H04N1/387,110 Stage: PROBLEM TO BE SOLVED: To provide an image processing apparatus capable of easily identifying a transportation direction of a sheet, and an image forming apparatus.SOLUTION: An image processing apparatus has a storage se...
Japan, March 5 -- NIPPON STEEL CORP has got intellectual property rights for 'WIRE MATERIAL.' Other related details are as follows: Application Number: JP,2022-113971 Category (FI): C22C38/00,301@Y,C22C38/54,C22C38/16,C21D8/06@A Stage: PROBLEM TO BE SOLVED: To provide a wire material capable of suppressing the generation of blisters.SOLUTION: There is provided a wire material having a chemical composition comprising by mass%, 0.70 to 1.20% of C, 0.10 to 1.00% of Si, 0.10 to 1.00% of Mn, 0.020...
Japan, March 5 -- NIPPON STEEL CORP has got intellectual property rights for 'WIRE MATERIAL.' Other related details are as follows: Application Number: JP,2022-113970 Category (FI): C22C38/00,301@Y,C22C38/08,C21D8/06@A,C22C38/16,C22C38/54 Stage: PROBLEM TO BE SOLVED: To provide a wire material capable of suppressing the generation of blisters.SOLUTION: There is provided a wire material having a chemical composition comprising by mass%, 0.70 to 1.20% of C, 0.10 to 1.00% of Si, 0.10 to 1.00% of...
Japan, March 5 -- HITACHI ASTEMO LTD has got intellectual property rights for 'PARKING SUPPORT DEVICE.' Other related details are as follows: Application Number: JP,2022-112606 Category (FI): B60R99/00,330,B60W30/06,B62D15/02,320 Stage: PROBLEM TO BE SOLVED: To enable parking support for parking to a parking area frequently used by a driver or the like, while reducing a load due to learning processing.SOLUTION: A parking support device comprises: a parking information learning section which r...
Japan, March 5 -- KYB CORP has got intellectual property rights for 'DAMPING VALVE AND DAMPER.' Other related details are as follows: Application Number: JP,2022-110283 Category (FI): F16K17/06@C,F16F9/46,F16K17/02@B,F16F9/34,F16F9/32@L Stage: PROBLEM TO BE SOLVED: To provide a damping valve which can inhibit increase of manufacturing costs without causing size increase even when enabling adjustment of damping force, and to provide a damper.SOLUTION: A damping valve V includes: a piston 5 hav...
Japan, March 5 -- SHINAGAWA REFRACTORIES CO LTD has got intellectual property rights for 'NOZZLE SHAPE REFRACTORY.' Other related details are as follows: Application Number: JP,2022-108345 Category (FI): B22D11/10,320@D,B22D41/28,B22D41/50,520,B22D11/10,340@Z Stage: PROBLEM TO BE SOLVED: To suppress edge cracking while maintaining the flow controllability of molten metal for an extended period of time.SOLUTION: A nozzle shape refractory has an upper nozzle 10, a slide plate unit 20 including ...
Japan, March 5 -- DIC CORP has got intellectual property rights for 'THERMOSETTING RESIN COMPOSITION, BULK MOLDING COMPOUND AND MOLDED ARTICLE THEREOF.' Other related details are as follows: Application Number: JP,2022-105814 Category (FI): C08F2/44@A,C08F2/44@C,C08F212/08,C08F283/01 Stage: PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition that offers excellent mixability and storage stability, exhibits low shrinkage during molding, and yields a molded article with superior ...
Japan, March 5 -- STANLEY ELECTRIC CO LTD has got intellectual property rights for 'SEMICONDUCTOR LIGHT-EMITTING DEVICE.' Other related details are as follows: Application Number: JP,2022-101266 Category (FI): H01L33/48,H10H20/85,H10H20/853,H10H20/854 Stage: PROBLEM TO BE SOLVED: To provide a configuration in which a transparent member of a UV-emitting semiconductor light-emitting device and a substrate are bonded by resin, while not impairing the bonding reliability.SOLUTION: A substrate 10 ...