Japan, July 27 -- DISCO CORP has got intellectual property rights for 'MACHINING DEVICE.' Other related details are as follows: Application Number: JP,2022-125465 Category (FI): B24B55/02@B,H10P52/00@C,H01L21/304,631,B23Q11/08@Z,B24B55/06,B24B7/04@A Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 5, 2022 Publication Date: Feb. 16, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, July 27 -- NIHON BOSAI SCHEME CO LTD has got intellectual property rights for 'LED BULB.' Other related details are as follows: Application Number: JP,2022-125378 Category (FI): F21K9/238,F21K9/00,100,F21K9/237,F21Y115:10,F21V29/83,F21V29/508,F21S9/02,F21K9/232 Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 5, 2022 Publication Date: Feb. 16, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated...
Japan, July 27 -- HOT BRAIN CO LTD has got intellectual property rights for 'EVACUEE INFORMATION PROVIDING SYSTEM, EVACUEE INFORMATION PROVIDING METHOD AND EVACUEE INFORMATION PROVIDING PROGRAM.' Other related details are as follows: Application Number: JP,2022-124748 Category (FI): G06Q50/26 Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 4, 2022 Publication Date: Feb. 16, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p...
Japan, July 27 -- SHINKO ELECTRIC IND CO LTD has got intellectual property rights for 'WIRING BOARD ASSEMBLY, WIRING BOARD, AND WIRING BOARD MANUFACTURING METHOD.' Other related details are as follows: Application Number: JP,2022-124328 Category (FI): H05K1/02@G,H05K3/46@B Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 3, 2022 Publication Date: Feb. 16, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Cu...
Japan, July 27 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'METHACRYL RESIN MOLDED ARTICLE AND METHACRYL RESIN COMPOSITION.' Other related details are as follows: Application Number: JP,2022-124175 Category (FI): G02B1/04,F21V1/22,G02B5/02@A,C08L33/10,C08L83/04,F21V7/00,510,C08J5/00 Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 3, 2022 Publication Date: Feb. 16, 2024 The original document can be viewed at: https://www.j-platpa...
Japan, July 27 -- MAXELL LTD has got intellectual property rights for 'SENSOR UNIT.' Other related details are as follows: Application Number: JP,2022-123813 Category (FI): H04B1/40,H01M50/247,H01M10/0562,H01M10/052,G08C17/00@Z Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 3, 2022 Publication Date: Feb. 16, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, July 27 -- SHINKO WIRE CO LTD has got intellectual property rights for 'CORROSION PREVENTION METHOD AND STRUCTURAL CABLE SUBJECTED TO CORROSION PREVENTION METHOD.' Other related details are as follows: Application Number: JP,2022-123670 Category (FI): E01D11/04,E01D22/00@A,E01D11/02,G01N31/00@B,G01N19/10@A,G01N17/00,E01D19/16 Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 3, 2022 Publication Date: Feb. 16, 2024 The original document can be viewe...
Japan, July 27 -- EBARA CORP has got intellectual property rights for 'INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD.' Other related details are as follows: Application Number: JP,2022-122766 Category (FI): H10P70/00,103@Z,B24B37/013,H01L21/304,622@R,H10P95/00,102@Z,H10P70/00,104@Z,H01L21/304,643@Z,H10P52/40,H10P52/00@V,B24B49/12,B24B49/00,G05B19/418@Z,H10P52/00@T,H10P52/00@U,H01L21/304,622...
Japan, July 27 -- SUMITOMO ELECTRIC IND LTD has got intellectual property rights for 'SEMICONDUCTOR LASER ELEMENT AND MANUFACTURING METHOD THEREOF.' Other related details are as follows: Application Number: JP,2022-122614 Category (FI): H01S5/227,H01S5/12,H01S5/343 Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 1, 2022 Publication Date: Feb. 14, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by...
Japan, July 27 -- MEIJO UNIVERSITY,JAPAN STEEL WORKS LTD:THE has got intellectual property rights for 'SEMICONDUCTOR LASER AND MANUFACTURING METHOD THEREOF.' Other related details are as follows: Application Number: JP,2022-122479 Category (FI): H01S5/10 Stage: Grant (IP right granted following substantive examination.) Filing Date: Aug. 1, 2022 Publication Date: Feb. 14, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndica...